HP Grease THML pasta termoprzewodząca, 4 g, 8,5 W/mK, szara

System builders and IT technicians use HP Grease THML when mounting CPUs, GPUs, or chipsets to heatsinks. The syringe applicator delivers precise control for spreading a thin, even layer, and the carbon micro-particle formula fills microscopic surface gaps to improve heat transfer.

Key specifications

• Thermal conductivity: 8.5 W/(mK)
• Net content: 4 g
• Colour: Grey
• Operating temperature range: -50 to 160 °C
• Non-conductive and non-corrosive
• No curing time required

Why choose it

The high thermal conductivity of 8.5 W/(mK) makes it suitable for performance systems, while the non-conductive formula reduces the risk of short circuits if excess paste contacts nearby components. It remains stable across a wide temperature range and does not require curing, so systems can be powered on immediately after application.

Ideal use cases

• Installing or reseating CPU coolers in desktops and workstations
• Applying thermal interface material to GPUs and chipsets
• Maintenance of high-performance computing systems

Good to know

The paste has a shelf life of 8 years and complies with RoHS and REACH regulations. Store it in a cool, dry place and keep the cap tightly closed between uses.